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US 7,678,701 B2Granted
Flexible substrate with electronic devices formed thereon
AssigneeEastman Kodak Company
InventorsTimothy J. Tredwell, Roger S. Kerr
Life of this patent
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Abstract
A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
Claims32
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises at least one plastic material;
- b) embedding a particulate material in at least one surface of the substrate;
- c) forming a thin film electronic device on said surface with said particulate material;
- and
- further comprising:
- d) embedding the particulate material in a second surface of the substrate;
- and
- e) forming a thin film electronic device on said second surface having said embedded particulate material.
5 more elements
A method of manufacturing an electronic device comprising:
- a) providing a substrate that comprises at least one plastic material;
- b) forming a pattern on at least one surface of said substrate;
- c) embedding a particulate material into the at least one surface of said substrate;
- d) applying a planarization material to the surface of the substrate having the embedded particulate material, forming a planarization layer thereby;
- e) forming a thin film electronic device on said surface with said particulate material;
- and
- wherein the pattern comprises one or more lens elements.
4 more elements
Dependencies are inferred from the claim text.