Interposer and method for producing the same and electronic device

A method for producing an interposer interposed between a wiring board and an electronic element mounted on the wiring board and used to form an electronic device, and including a flat plate shaped substrate made of an inorganic material;

• a through wiring including conductors embedded in one or more through holes passing through the substrate;
• and an upper wiring and/or a lower wiring that are respectively formed in predetermined patterns on the surfaces of the substrate and electrically conducted through the through wiring,
• the method for producing the interposer comprising the steps of:
• applying an insulating material for at least wiring forming parts of the substrate;
• forming simultaneously or sequentially preliminary wiring patterns on layers made of the insulating material;
• and
• forming the through wiring, the upper wiring and the lower wiring on the preliminary wiring patterns,
• at that time, using a metal mold for forming the preliminary wiring patterns, and
• employing the metal mold as the through wiring, the upper wiring and the lower wiring, or
• applying a wiring material on the preliminary wiring patterns formed on the layers of the insulating material by transferring a fine structure pattern of the metal mold by a printing operation, a plating operation or a deposition to form the through wiring, the upper wiring and the lower wiring.