Electronic component built-in substrate and method of manufacturing the same
AssigneeShinko Electric Industries Co., Ltd.
InventorKiyoshi Oi
Life of this patent
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Abstract
In an electronic component built-in substrate of the present invention, an electronic component is mounted on a mounted body having a first wiring layer, the electronic component is embedded in an insulating layer, a conductive ball is arranged to pass through the insulating layer and connected electrically to the first wiring layer, a second wiring layer connected electrically to the conductive ball is formed on the insulating layer, and the first wiring layer and the second wiring layer are interlayer-connected via the conductive ball.
Claims9
A method of manufacturing an electronic component built-in substrate, comprising the steps of:
- mounting an electronic component on a mounted body having a first wiring layer;
- forming an insulating layer in which the electronic component is embedded;
- forming a structure in which, a conductive ball constructed by a ball portion and a coating portion for coating the ball portion is connected to the first wiring layer to pass through the insulating layer, and the ball portion and the coating portion are formed of different metal materials, and the coating portion of the upper portion of the conductive ball is removed to reach the ball portion;
- and
- forming a second wiring layer, which contacts the ball portion and is directly connected to the ball portion, on the insulating layer.
An electronic component built-in substrate, comprising:
- a mounted body having a first wiring layer;
- an electronic component mounted on the mounted body;
- an insulating layer in which the electronic component is embedded;
- a conductive ball arranged to pass through the insulating layer, and connected electrically to the first wiring layer;
- and
- a second wiring layer formed on the insulating layer, and connected electrically to the conductive ball, wherein
- the conductive ball is constructed by a ball portion and a coating portion for coating the ball portion, and the ball portion and the coating portion are formed of different metal materials, and the coating portion of the upper portion of the conductive ball is removed to reach the ball portion, and the second wiring layer contacts the ball portion and is directly connected to the ball portion.
Dependencies are inferred from the claim text.