Method of bonding MEMS integrated circuits
AssigneeSilverbrook Research Pty Ltd
InventorsRoger Mervyn Lloyd Foote, Kia Silverbrook
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Abstract
A method of bonding an integrated circuit to a substrate is provided. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method comprises the steps of: (a) positioning a substrate at a backside of the integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the integrated circuit; and (c) applying a bonding force from the bonding tool, through the film frame tape and the integrated circuit, onto the substrate.
Claims20
A method of bonding an integrated circuit to an adhesive substrate, said method comprising the steps of:
- (a) providing a film frame tape supported by a wafer film frame, said film frame tape having a plurality of integrated circuits releasably attached via respective frontsides to said film frame tape;
- (b) positioning said adhesive substrate at a backside of one individual integrated circuit;
- (c) positioning a bonding tool on a zone of said film frame tape, said zone being aligned with said individual integrated circuit;
- and
- (d) applying a bonding force from said bonding tool, through said film frame tape and said individual integrated circuit, onto said adhesive substrate, thereby bonding said backside of said individual integrated circuit to said adhesive substrate.
A method of constructing a printhead using a plurality of printhead integrated circuits, said method comprising the steps of:
- (a) providing a film frame tape supported by a wafer film frame, said film frame tape having a plurality of printhead integrated circuits releasably attached via respective frontsides to said film frame tape;
- (b) positioning an adhesive substrate at a backside of one of said printhead integrated circuits;
- (c) positioning a bonding tool on a zone of said film frame tape, said zone being aligned with said printhead integrated circuit;
- (d) applying a bonding force from said bonding tool, through said film frame tape and said printhead integrated circuit, onto said adhesive substrate, thereby bonding said backside of said printhead integrated circuit to said adhesive substrate;
- (e) repeating steps (b) to (d) so as to construct a printhead on said substrate, wherein said printhead comprises a predetermined number of abutting printhead integrated circuits.
Dependencies are inferred from the claim text.