Methods using die attach paddle for mounting integrated circuit die
AssigneeAtmel Corporation
InventorKen M. Lam
Life of this patent
Estimating the term…
Abstract
An electrical package for an integrated circuit die which comprises a die-attach paddle for mounting the integrated circuit die. The die-attach paddle has at least one down-set area located on a periphery of the die-attach paddle. The down-set area has an upper surface and a lower surface, with the upper surface configured to electrically couple a first end of a first electrically conductive lead wire. A second end of the first electrically conductive lead wire is bonded to the integrated circuit die. The upper surface is further configured to electrically couple a first end of a second electrically conductive lead wire and a second end of the second electrically conductive lead wire is bonded to a lead finger of the electrical package.
Claims22
A method for attaching an integrated circuit die to an electrical package, comprising:
- adhering the integrated circuit die to an uppermost portion of a die-attach paddle;
- bonding a first lead wire from the integrated circuit die to a down-set portion of the die-attach paddle at a periphery thereof;
- bonding a second lead wire from the down-set portion to a lead finger of the electrical package;
- and
- encapsulating the integrated circuit die and the die-attach paddle, leaving a section of the down-set portion exposed.
A method for attaching an integrated circuit die to an electrical package comprising:
- adhering the integrated circuit die to an uppermost portion of a die-attach paddle, the die-attach paddle being selected to have a down-set portion on a periphery of the die-attach paddle;
- bonding a first lead wire from the integrated circuit die to the down-set portion of the die-attach paddle;
- bonding a second lead wire from the down-set portion of the die-attach paddle to a lead finger of the electrical package;
- encapsulating the integrated circuit die and the die-attach paddle;
- masking a lowermost section of the down-set portion of the die-attach paddle;
- plating an exposed area of the lead finger;
- unmasking the lowermost section of the down-set portion of the die-attach paddle;
- removing a lower section of the down-set portion of the die-attach paddle with a chemical etchant;
- removing a conductive material plated onto an uppermost surface of the down-set portion by chemical etching;
- and
- filling a void left by removing the conductive material and the lower section of the down-set portion of the die-attach paddle with epoxy.
A method for attaching an integrated circuit die to an electrical package, comprising:
- adhering the integrated circuit die to an uppermost portion of a die-attach paddle, the die-attach paddle including a down-set portion on a periphery of the die-attach paddle;
- bonding a first end of a lead wire to the integrated circuit die;
- bonding a center portion of the lead wire to the down-set portion of the die-attach paddle;
- bonding a second end of the lead wire to a lead finger of the electrical package;
- and
- encapsulating the integrated circuit die and die-attach paddle, including leaving a section of the down-set portion exposed.
A method for attaching an integrated circuit die to an electrical package, comprising:
- adhering the integrated circuit die to an uppermost portion of a die-attach paddle, the die-attach paddle being selected to have a down-set portion on a periphery of the die-attach paddle;
- bonding a first end of a lead wire to the integrated circuit die;
- bonding a center portion of the lead wire to the down-set portion of the die-attach paddle;
- bonding a second end of the lead wire to a lead finger of the electrical package;
- encapsulating the integrated circuit die and die-attach paddle;
- masking any exposed lowermost section of the down-set portion of the die-attach paddle;
- plating an exposed area of the lead finger;
- unmasking the lowermost section of the down-set portion of the die-attach paddle;
- removing a lower section of the down-set portion of the die-attach paddle with a chemical etchant;
- removing a conductive material plated onto an uppermost surface of the down-set portion by chemical etching;
- and
- filling a void left by removing the conductive material and the lower section of the down-set portion of the die-attach paddle with epoxy.
A method for attaching an integrated circuit die to an electrical package, comprising:
- attaching the integrated circuit die to an uppermost portion of a die-attach paddle;
- attaching a first lead wire portion from the integrated circuit die to a down-set portion on a periphery of the die-attach paddle;
- attaching a second lead wire portion from the down-set portion of the die-attach paddle to a lead of the electrical package;
- encapsulating the integrated circuit die and the die-attach paddle;
- masking a lowermost section of the down-set portion of the die-attach paddle;
- plating an exposed area of the lead finger;
- unmasking the lowermost section of the down-set portion of the die-attach paddle;
- etching away a lower section of the down-set portion of the die-attach paddle;
- etching a conductive material plated from an uppermost surface of the down-set portion;
- and
- filling, with epoxy, a void left by removing the conductive material and the lower section of the down-set portion of the die-attach paddle.
Dependencies are inferred from the claim text.