Thermal management method including a metallic layer directly on an integrated heat spreader and integrated circuit
AssigneeIntel Corporation
InventorsJiun Hann Sir, Chee Koang Chen
Life of this patent
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Abstract
An apparatus, method, and system for providing thermal management for an integrated circuit includes a first metallic layer directly placed on a back surface of the integrated circuit. An integrated heat spreader with a substantially cap-like shape is placed over the integrated circuit, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part. The first metallic layer is directly placed on top of an exterior surface of the ceiling wall of the integrated heat spreader as well as the back surface of the integrated circuit.
Claims9
A method comprising:
- attaching an integrated circuit to a substrate;
- placing an integrated heat spreader having a substantially cap-like shape on the substrate, with an aperture of a ceiling wall of the integrated heat spreader exposing a back surface of the integrated circuit at least in part;
- and
- placing a first metallic layer directly on top of an exterior surface of the ceiling wall of the integrated heat spreader and the back surface of the integrated circuit.
A method comprising:
- attaching an integrated circuit to a substrate;
- placing a dummy integrated heat spreader having a substantially cap-like shape on the substrate, with an aperture of a ceiling wall of the dummy integrated heat spreader exposing a back surface of the integrated circuit in totality;
- and
- placing a first metallic layer directly on top of an exterior surface of the ceiling wall of the dummy integrated heat spreader and the back surface of the integrated circuit.
Dependencies are inferred from the claim text.