Back to results
US 7,678,612 B2Granted
Method of manufacturing semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsTomoharu Fujii, Kiyoshi Oi
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a semiconductor device includes: a step of forming a via plug erected on an electrically conductive layer, and embedding the via plug in an insulation layer to form a wiring structure; and a step of bonding the wiring structure to a wiring substrate including electronic components mounted thereon.
Claims8
A method for manufacturing a semiconductor device comprising:
- a step of forming a plurality of via plugs erected on an electrically conductive layer, and embedding the via plugs in an insulation layer to form a wiring structure;
- a step of forming a bonding layer on a tip of the via plugs;
- a step of forming a bonding layer on a portion of a pattern wiring of a wiring substrate to be connected to the tip of the via plugs;
- and
- a step of bonding the wiring structure to a surface of the wiring substrate on which an electronic component is mounted thereon, wherein an entire wiring substrate is provided at one side of the electronic component, and heat/pressure is applied to the wiring structure so as to be pressed against the wiring substrate to connect the tip of the via plugs of the wiring structure to the pattern wiring of the wiring substrate, wherein
- surfaces of the electronic component other than a surface that is in contact with the wiring substrate are embedded in the insulation layer that embeds the via plugs of the wiring structure, a wherein the electronic component includes an active element and an passive element forming a radio communication module.
3 more elements
A method for manufacturing a semiconductor device comprising:
- a step of forming a plurality of via plugs erected on an electrically conductive layer to form a via plug structure;
- a step of forming a bonding layer on a tip of the via plugs of the via plug structure;
- a step of forming a bonding layer on a portion of a pattern wiring of a wiring substrate to be connected to the tip of the via plugs of the via plug structure;
- and
- a step of bonding the via plug structure to a surface of the wiring substrate on which an electronic component is mounted thereon while inserting an insulating layer between the via plug structure and the wiring substrate, wherein an entire wiring substrate is provided at one side of the electronic component, and heat/pressure is applied to the via plug structure so as to be pressed against the wiring substrate, to connect the tip of each via plug of the via plug structure to the pattern wiring of the wiring substrate,
- wherein the via plugs of the via plug structure and surfaces of the electronic component other than a surface that is in contact with the wiring substrate are embedded in the insulating layer, wherein the electronic component includes an active element and an passive element forming a radio communication module.
3 more elements
Dependencies are inferred from the claim text.