Semiconductor chip package and method of manufacture

A method of forming a chip package comprising:

• providing a first chip unit comprising a first IC chip and a first substrate, wherein the first IC chip is electrically connected to the first substrate through an opening in the first substrate;
• providing a second chip unit comprising a second IC chip and a second substrate, wherein the second IC chip is electrically connected to the second substrate through an opening in the second substrate;
• wherein each of the first substrate, the first IC chip, the second substrate and the second IC chip have first and second planar surfaces and the second planar surface of the first IC chip is mounted to the first planar surface of the first substrate and the second planar surface of the second IC chip is mounted to the first planar surface of the second substrate;
• wherein the method further comprises
• providing an adhesive on the first planar surface of the second IC chip;
• and
• mounting the second planar surface and the opening of the first substrate on the adhesive on the first planar surface of the second IC chip;
• wherein at least a portion of the second planar surface and the opening of the first substrate which contacts the adhesive is unencapsulated before mounting;
• and
• wherein the unencapsulated portion of the second planar surface and the opening of the first substrate is encapsulated by the adhesive after mounting.