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US 7,678,609 B2Granted
Semiconductor package with redistributed pads
AssigneeInternational Rectifier Corporation
InventorMark Pavier
Life of this patent
Estimating the term…
Abstract
A method for fabricating a semiconductor package which includes coupling an electrode of a semiconductor device to a portion of a lead frame, overmolding at least a portion of the die, and then removing a portion of the die to obtain a desired thickness.
Claims26
A method of fabricating a semiconductor package, comprising:
- electrically and mechanically coupling one electrode on a front surface of a semiconductor die to one portion of a lead frame with a conductive adhesive body;
- providing overmolding for said semiconductor die;
- and
- removing a portion of said semiconductor die from the back surface thereof to a desired thickness;
- wherein a portion of said overmolding is removed during said removing said portion of said semiconductor die.
2 more elements
Dependencies are inferred from the claim text.