Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor

A method for manufacturing a capacitive semiconductor sensor comprising:

• forming a plurality of circuit chips in a wafer, wherein each circuit chip includes a pad for testing a sensor chip;
• bonding the wafer on a first dicing tape;
• cutting the wafer into individual circuit chips;
• bonding the sensor chip on each circuit chip with a bump so that the sensor chip is electrically coupled with the circuit chip, wherein each sensor chip is made of semiconductor and has a capacitance changing portion, which is disposed on one side of the sensor chip and has a variable capacitance, wherein the circuit chip detects a capacitance change of the sensor chip, and wherein the one side of the sensor chip faces the circuit chip;
• testing each sensor chip through the pad;
• and
• removing the first dicing tape from the circuit chips after the bonding so that the circuit chip and the sensor chip provide the capacitive semiconductor sensor.