Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these films
AssigneeSumitomo Bakelite Co., Ltd.
InventorsHiromichi Sugiyama, Toshio Banba, Shusaku Okamyo
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Abstract
A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, and R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.
Claims12
A positive-type photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1),
- wherein R1 and R2 represent alkyl groups having 1 to 10 carbon atoms, R3 represents an organic group, R4 represents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.
Dependencies are inferred from the claim text.