Dielectric and display device having a dielectric and dielectric manufacturing method
AssigneeE.I. du Pont de Nemours and Company
InventorsKeiichiro Hayakawa, Masakatsu Kuroki
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Abstract
This invention provides a thick-film type dielectric with desired adhesivity to the base and very good insulation properties. The dielectric of the present invention includes a lower dielectric layer made of a photosensitive composition and an upper dielectric layer which is made of a photosensitive composition and formed on the aforementioned lower dielectric layer. The softening point (T1) of the primary glass powder used for the aforementioned lower dielectric layer, the softening point (T2) of the primary glass powder used for the aforementioned upper dielectric layer, and the firing temperature (T3) of the aforementioned primary glass powder satisfy the following relationship: T1<T3<T2<T3+30° C.
Claims37
A dielectric comprising a lower dielectric layer and an upper dielectric layer formed on said lower dielectric layer, said lower dielectric layer comprising a first primary glass powder and said upper dielectric layer comprising a second primary glass powder wherein the softening point (T1) of said first primary glass powder, the softening point (T2) of said second primary glass powder, and the firing temperature (T3) of the primary glass powder which is present in the greatest volume satisfies the following relationship:
- T1<T3<T2<T3+30° C.
A dielectric manufacturing method having the following steps:
- providing a lower dielectric composition and an upper dielectric composition each comprising a primary glass powder, resin binder, and organic solvent;
- providing a substrate;
- coating said lower dielectric composition on said substrate;
- drying said lower dielectric composition and substrate to form a lower dielectric layer;
- coating said upper dielectric composition on said lower dielectric layer;
- drying said upper dielectric composition to form an upper dielectric layer;
- firing said lower dielectric layer and said upper dielectric layer at a firing temperature that satisfies the relationship of T1<T3<T2<T3+30° C. wherein T1 is the softening point of the primary glass powder of the lower dielectric layer, T2 is the softening point of the primary glass powder of the upper dielectric layer, and T3 is the firing temperature of the primary glass powder which is present in the greatest amount by volume.
Dependencies are inferred from the claim text.