Method of forming wiring pattern and method of forming gate electrode for TFT

A method of forming a wiring pattern, in which a conductive material layer is formed on a substrate by discharging a plurality of droplets of a conductive material in a liquid phase using a droplet discharge device in a pattern formation region having:

• a first region, which is bordered by a liquid-repellant pattern and has a first width;
• and
• a second region, which touches the first region and has a second width smaller than the first width, the method comprising:
• forming the conductive material layer to cover the first region and the second region by discharging the plurality of droplets having a diameter smaller than the first width and greater than the second width toward the first region, wherein
• the forming of the conductive material layer includes discharging the plurality of droplets so that one droplet among the plurality of droplets, which lands at a position closest to a boundary line between the first region and the second region, is isolated from other droplets during a predetermined period of time on the first region until the one droplet which lands at a position closest to a boundary line spreads over the width of the second region.