Process for producing adhesive film
AssigneeKaneka Corporation
InventorsMasami Yanagida, Hisayasu Kaneshiro, Takashi Kikuchi, Hiroyuki Tsuji
Life of this patent
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Abstract
A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.
Claims13
A process for producing an adhesive film, comprising:
- laminating an adhesive layer comprising a thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method by coextruding a precursor solution of the highly heat-resistant polyimide with a precursor of the thermoplastic polymide, wherein when charged into an extruder for the coextrusion process, the precursor solution of the highly heat-resistant polyimide contains both a chemical dehydrator and a catalyst, and the precursor of the thermoplastic polyimide does not contain a catalyst or a chemical dehydrator.
A process for producing an adhesive film laminate comprising at least one a highly heat-resistant polyimide layer and at least one thermoplastic polyimide, the laminate being prepared within predetermined thickness parameters for the layers, and the laminate having a target predetermined coefficient of thermal expansion comprising:
- a) identifying a target predetermined coefficient of thermal expansion for the adhesive film laminate;
- b) formulating a precursor of a thermoplastic polyimide wherein the precursor of the thermoplastic polyimide does not contain a catalyst or a chemical dehydrator;
- c) formulating a precursor solution of a highly heat-resistant polyimide wherein the precursor solution of the highly heat-resistant polyimide contains both a chemical dehydrator and a catalyst;
- d) based on the formulations in steps b) and c) and the predetermined thickness parameters of the layers, formulating an amount of a chemical dehydrator and a catalyst to be contained in the precursor solution of the highly heat-resistant polyimide to provide an adhesive film laminate having the target predetermined coefficient of thermal expansion for the adhesive film laminate;
- and
- e) laminating at least one adhesive layer comprising a thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting the precursor solution of the highly heat-resistant polyimide and the solution containing a precursor of the thermoplastic polyimide as formulated in step d).
A process for producing an adhesive film, comprising:
- laminating an adhesive layer comprising a thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method by coextruding a precursor solution of the highly heat-resistant polyimide with a precursor of the thermoplastic polyimide, wherein when charged into an extruder for the coextrusion process, the precursor solution of the highly heat-resistant polyimide contains both a chemical dehydrator and a catalyst, and the precursor of the thermoplastic polyimide does not contain a chemical dehydrator.
Dependencies are inferred from the claim text.