Circulated cooled target

A circulated cooled sputtering target, comprising:

• a first target chamber, said first target chamber having a hole part at center of said first target chamber, said hole part having a first foil layer at an end of said hole part and a second foil layer at the opposite end of said hole part, said first target chamber having a flow channel encircling said hole part at a rim of said hole part on a surface of said first target chamber, said first target chamber having a liquid inlet and a gas inlet on an outside surface of said first target chamber, said liquid inlet and said gas inlet both connecting to said flow channel;
• a second target chamber, said second target chamber deposing on a surface of said first target chamber which surface has said flow channel, said second target chamber having a communicating chamber at center of said second target chamber, said communicating chamber having a notch in a rim of said communicating chamber, said notch extending from said rim into said communicating chamber, said second target chamber having an outlet on an outside surface of said second target chamber, said outlet connecting to said communicating chamber;
• a carrier element, said carrier element being located in said communicating chamber, said carrier element having a store part at an end surface of said carrier element, said carrier element having an indented ring encircling said carrier element, said indented ring having a gap at a position at a side of said indented and a sputtering target located on said first foil layer.