System and method for manufacturing flexible copper clad laminate film

A cleaning device for manufacturing flexible copper clad laminate film comprising:

• a cleaning bath having an upper guide roll and a feed roll rotatably positioned on the front upper portion and rear portion thereof, respectively, to guide a to-be-plated film having copper coatings formed on its both surfaces, a lower guide roll that is both vertically adjustable relative to and carried by the lower portion of a pair of movable lateral walls, which are positioned on both sides of the internal center in such a manner that they can slide, to guide the film while it is fed, and a number of pairs of spray nozzles positioned on external lateral walls and the movable lateral walls between the upper guide roll and the lower guide roll, as well as between the lower guide roll and the feed roll, to spray a cleaning liquid to both surfaces of the film while it is fed, wherein the movable lateral walls are vertically slidable relative to the external lateral walls;
• a cleaning liquid reservoir for reserving a cleaning liquid to be supplied to the cleaning bath;
• a feed pump for pumping the cleaning liquid to the cleaning bath to spray it to the film and supplying the cleaning liquid from an external cleaning liquid tank to the cleaning liquid reservoir;
• and
• a filter for removing alien substances from the cleaning liquid supplied to the cleaning bath.

A copper plating device for manufacturing flexible copper clad laminate film comprising:

• a plating bath having conductive rolls positioned on the front upper portion thereof to guide a to-be-plated film and supply negative current to copper coatings formed on both surfaces of the film, a feed roll positioned on the rear upper portion to feed the film, a lower guide roll that is both vertically adjustable relative to and carried by the lower portion of a pair of movable lateral walls, which are positioned at the center in such a manner that they can slide vertically relative to the plating bath, to guide the film while it is fed, and a number of pairs of jigs, to which positive current is supplied to form copper plating layers on the copper coatings of the film while it passes between them, the plating bath containing a plating liquid, into which the film is dipped while being fed;
• a plating liquid reservoir positioned below the plating bath;
• a plating liquid supply pump for supplying a plating liquid from the plating liquid reservoir to the plating bath;
• and
• a filter for removing alien substances from the plating liquid supplied to the plating bath.