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AssigneeC. Uyemura & Co., Ltd.
InventorsAkihiko Murasumi, Seigo Kurosaka, Hiromu Inagawa, Yukinori Oda
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Disclosed is an electroless palladium plating bath containing a palladium compound, at least one complexing agent selected from ammonia and amine compounds, at least one reducing agent selected from phosphinic acid and phosphinates, and at least one unsaturated carboxylic acid compound selected from unsaturated carboxylic acids, unsaturated carboxylic acid anhydrides, unsaturated carboxylates and unsaturated carboxylic acid derivatives. Such an electroless palladium plating bath has high bath stability, and decomposition of the bath hardly occurs. Consequently, the electroless palladium plating bath of the present invention has a longer bath life than conventional electroless palladium plating baths. In addition, this electroless palladium plating bath enables to obtain excellent solder bonding characteristics and wire bonding characteristics since it does not affect plating film characteristics even when it is used for a long time.
An electroless palladium plating bath comprising a palladium compound, at least one complexing agent selected from the group consisting of ammonia and amine compounds, at least one reducing agent selected from the group consisting of phosphinic acid and phosphinate salts, and at least one unsaturated carboxylic acid compound selected from the group consisting of acrylic acid, propiolic acid, crotonic acid, isocrotonic acid, methacrylic acid, citraconic acid, trans-2-butene-1,4-dicarboxylic acid, itaconic acid, tetrolic acid, aconitic acid, muconic acid, sorbic acid, tiglic acid, angelic acid, senecionic acid, glutaconic acid, mesaconic acid, oleic acid, linoleic acid, cinnamic acid, and anhydrides, salts and derivatives thereof.
Dependencies are inferred from the claim text.