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US 7,678,055 B2Granted
Ultrasonic probe with a conductive substrate connected to a transducer
AssigneeKabushiki Kaisha Toshiba
InventorsMasaaki Sudo, Susumu Hiki, Shinichi Sato, Taihei Sato
Life of this patent
Estimating the term…
Abstract
A piezoelectric transducer for sending and receiving an ultrasonic wave and an FPC for applying current to the piezoelectric transducer is provided, the FPC is arranged oppositely to a side face of the piezoelectric transducer, and a soldering material for electrically connecting the piezoelectric transducer to the FPC is arranged in a corner portion formed by the piezoelectric transducer and the FPC.
Claims10
An ultrasonic probe, comprising:
- a piezoelectric transducer configured to send and to receive an ultrasonic wave;
- a conductive substrate for applying current to the piezoelectric transducer, wherein the conductive substrate is arranged oppositely to a side face of the piezoelectric transducer and has an end portion that is arranged outside of the side face of the piezoelectric transducer, the substrate further comprising a signal wiring and an earth wiring;
- first and second conductive materials arranged in first and second corner portions formed by the piezoelectric transducer and the conductive substrate, the conductive material electrically connecting the piezoelectric transducer to the conductive substrate;
- and
- a nonconductive material arranged on the side face of the piezoelectric transducer between the first and second corner portions, the nonconductive material insulating the first corner portion from the second corner portion.
2 more elements
Dependencies are inferred from the claim text.