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US 7,677,959 B2Granted
Multilayer polishing pad and method of making
AssigneeApplied Materials, Inc.
InventorRobert D. Tolles
Life of this patent
Estimating the term…
Abstract
A polishing pad has a polishing layer with a polishing surface and a first registration mark, and a backing layer connected to the polishing layer and having a second registration mark aligned with the first registration mark. The polishing pad may have a window that includes an aperture in the backing layer aligned with a solid transparent portion in the polishing layer.
Claims23
A polishing pad comprising:
- a single-piece polishing layer having a circular shape and a polishing surface suitable for polishing of a wafer undergoing integrated circuit fabrication and a first registration mark at an edge of the polishing pad;
- a single-piece backing layer having a circular shape, being connected to the polishing layer and having a second registration mark at an edge of the polishing pad and aligned with the first registration mark of the polishing layer;
- and
- a window through the polishing layer and the backing layer.
1 more element
A method of assembling a polishing pad, comprising:
- forming a single-piece polishing layer having a circular shape and a polishing surface and a first registration mark at an edge of the polishing pad;
- forming a single-piece backing layer having a circular shape and a second registration mark at an edge of the polishing pad;
- aligning the first registration mark of the polishing layer with the second registration mark of the backing layer;
- and
- connecting the polishing layer to the backing layer.
2 more elements
A polishing pad comprising:
- a circular single-piece polishing layer having a polishing surface and a first registration mark;
- a circular single-piece backing layer connected to the polishing layer and having a second registration mark aligned with the first registration mark of the polishing layer;
- and
- a window through the polishing layer and the backing layer.
1 more element
A polishing pad comprising:
- a polishing layer having a polishing surface suitable for polishing of a wafer undergoing integrated circuit fabrication, wherein the polishing layer has a circular circumference defining an edge of the polishing layer and a first notch at the edge;
- a backing layer connected to the polishing layer, wherein the backing layer has a circular circumference defining an edge of the backing layer and a second notch at the edge of the backing layer and aligned with the first notch of the polishing layer;
- and
- a window through the polishing layer and the backing layer.
1 more element
A method of assembling a polishing pad, comprising:
- forming a polishing layer having a polishing surface suitable for polishing of a wafer undergoing integrated circuit fabrication, wherein the polishing layer has a circular circumference defining an edge of the polishing layer and a first notch at the edge;
- forming a backing layer connected to the polishing layer, wherein the backing layer has a circular circumference defining an edge of the backing layer and a second notch at the edge of the backing layer;
- aligning the first notch of the polishing layer with the second notch of the backing layer;
- and
- connecting the polishing layer to the backing layer.
2 more elements
Dependencies are inferred from the claim text.