Back to results
US 7,677,956 B2Granted
Compositions and methods for dielectric CMP
AssigneeCabot Microelectronics Corporation
InventorsPhillip Carter, Gregory H Bogush, Farhana Khan, Timothy P Johns, Robert Vacassy
Life of this patent
Estimating the term…
Abstract
The invention is directed to a chemical-mechanical polishing composition comprising (a) an abrasive consisting essentially of aggregated silica, (b) an acid, and (c) a liquid carrier, wherein the polishing composition has a pH of about 5 or less. The invention is also directed to a method of polishing a substrate comprising a dielectric layer using the polishing composition.
Claims22
A method of polishing a substrate comprising:
- (i) contacting a substrate having a surface area comprising a dielectric layer with a chemical-mechanical polishing composition comprising:
- (a) an abrasive consisting essentially of aggregated silica,
- (b) an acid, wherein the acid is an anionic polymer or copolymer, and wherein the anionic polymer or copolymer comprises repeating units selected from the group consisting of styrenesulfonic acid, 2-acrylamido-2-methylpropane sulfonic acid, salts thereof, and combinations thereof, and
- (c) a liquid carrier,
- wherein the dielectric layer comprises about 95% or more of the total surface area of the substrate, and wherein the polishing composition has a pH of about 3 or less, and
- (ii) abrading at least a portion of the substrate to polish the dielectric layer.
3 more elements
A chemical-mechanical polishing composition comprising:
- (a) an abrasive consisting essentially of aggregated silica having a surface area of about 30 m2/g to about 70 m2/g and a particle size of about 100 nm to about 250 nm,
- (b) an acid, wherein the acid is an anionic polymer or copolymer, and wherein the anionic polymer or copolymer comprises repeating units selected from the group consisting of styrenesulfonic acid, 2-acrylamido-2-methylpropane sulfonic acid, salts thereof, and combinations thereof, and
- (c) a liquid carrier,
- wherein the polishing composition has a pH of about 3 or less.
1 more element
Dependencies are inferred from the claim text.