Electronic device substrate, electronic device, method of manufacturing electronic device, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorMinoru Koyama
Life of this patent
Estimating the term…
Abstract
An electronic device substrate includes an insulating plate base, an electronic circuit formed on one surface of the base, and a conductive film formed on the other surface of the base and having electrical conductivity. The electronic device substrate is completed through a manufacturing process including charge-removal movement in which removal of a charge of the base is combined with movement of the electronic device substrate. In the charge-removal movement, the electronic device substrate is moved with being supported by a substrate support part that has electrical conductivity and is grounded. The substrate support part abuts the conductive film during the charge-removal movement.
Claims17
An electronic device substrate comprising:
- an insulating plate base with a first terminal end and a second terminal end;
- an electronic circuit formed on one surface of the base;
- and
- a conductive film formed on the other surface of the base and having electrical conductivity, wherein:
- the electronic device substrate is completed through a manufacturing process including charge-removal movement in which removal of a charge of the base is combined with movement of the electronic device substrate;
- in the charge-removal movement, the electronic device substrate is moved while being supported by a roller that has electrical conductivity and is grounded, wherein the roller abuts the conductive film and rolls to moveably support the electronic device substrate during the charge-removal movement;
- the conductive film extends continuously about an entire periphery of the other surface of the base;
- and
- the conductive film has a part that is formed into a stripe extending continuously from the first terminal end to the second terminal end and along the movement direction of the electronic device substrate in the charge-removal movement.
A method of manufacturing an electronic device, comprising:
- completing an electronic device substrate that has an insulating plate base and an electronic circuit formed on one surface of the base, through a manufacturing process including movement of the electronic device substrate in association with removal of a charge of the base, the electronic device substrate having a conductive film that extends continuously about an entire periphery of the other surface of the base and has electrical conductivity, the conductive film has a part that is formed into a stripe extending continuously from a first terminal end of the insulating plate base to a second terminal end of the insulating plate base, the electronic device substrate being moveably supported by a roller that has electrical conductivity and is grounded, the roller rolling while abutting the stripe of the conductive film during the movement;
- and
- mounting the electronic device substrate in a casing that has an electrically conductive coating formed on the inside surface of the casing, so that the conductive film is brought into contact with the coating on the inside surface of the casing.
Dependencies are inferred from the claim text.