Extended package substrate

A method comprising:

• coupling a socket to an integrated circuit package comprising an integrated circuit package substrate and having a face, the socket having a footprint, the integrated circuit package substrate comprising a first side, a second side, a third side and a fourth side, the socket comprising a first wall in contact with the first side, a second wall in contact with the second side, a third wall in contact with the third side, and a fourth wall defining an opening, a portion of the integrated circuit package substrate extending through the opening, the face of the integrated circuit package substrate having a length extending from the first side of the integrated circuit package substrate to the fourth side of the integrated circuit package substrate, the footprint of the socket having a length extending from an outer side of the first wall to an outer side of the fourth wall, the length of the footprint of the socket being smaller than the length of the face of the integrated circuit package substrate;
• and
• biasing the integrated circuit package substrate towards the first wall of the socket using a flexible member, wherein the fourth wall of the socket restricts movement of the flexible member away from the first wall of the socket, wherein the integrated circuit package substrate defines a notch, and wherein at least a portion of the flexible member is disposed within the notch.