Light emitting device having a metal can package for improved heat dissipation
AssigneeAvago Technologies General IP (Singapore) Pte. Ltd.
InventorsArosh Baroky Tajul, Janet BeeYin Chua
Life of this patent
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Abstract
A light emitting device having an hermetically sealed package that includes a light source positioned in a metal can container on which is placed an optically-transparent cover. An enclosed space formed by the metal can container and the optically-transparent cover may be filled with an inert, heat-conducting gas or liquid and the inner surface of the metal can container may be coated with a high-reflector material that prevents absorption of the light emitted by the light source. A method of producing a light-emitting device having an hermetically-sealed package and a method of dissipating heat from a light-emitting device having an hermetically-sealed package is also provided.
Claims16
A light emitting device having an hermetically-sealed package (“LED-HSP”) for heat dissipation, the light emitting device comprising:
- a metal can having an interior surface and an open top;
- a metal base having a concave base cavity connected to said metal can;
- a semiconductor radiation source positioned in the concave base cavity of said metal base;
- an optically-transparent cover that covers the open top of the metal can and forms the hermetically-sealed package with the metal can, the hermetically sealed package forming an enclosed space above the metal base;
- a light pipe assembly positioned between the optically-transparent cover and the semiconductor radiation source, configured to transmit emitted light from the semiconductor radiation source to the optically-transparent cover;
- and
- a heat-conducting material comprising an inert gas or liquid material that fills the enclosed space of the hermetically-sealed package between the interior surface of the metal can and the light pipe assembly.
A method of producing a light-emitting device having a hermetically-sealed package for heat dissipation, the method comprising:
- forming a substrate that includes a base cavity;
- attaching a light source to the base cavity;
- placing the substrate in a metal can container having an interior surface and an open top;
- placing a light pipe assembly within the metal can container over the light source;
- covering the open top of the metal can container and the light pipe assembly with an optically-transparent cover
- injecting a heat-conducting material comprising an inert gas or liquid material into the metal can container between the interior surface of the metal can container and the light pipe assembly;
- and
- hermetically sealing the metal can container.
Dependencies are inferred from the claim text.