Micro-fluid ejection head with embedded chip on non-conventional substrate
AssigneeLexmark International, Inc.
InventorZhigang Xiao
Life of this patent
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Abstract
Micro-fluid ejection heads and methods for fabricating the same. One such micro-fluid ejection head includes a substrate having a plurality of fluid ejection actuator devices adjacent to a device surface thereof A valley is adjacent to the device surface of the substrate. A semiconductor chip is associated with the plurality of fluid ejection actuator devices. The chip is in the valley adjacent the device surface of the substrate. A conductive material is deposited adjacent to the device surface of the substrate. The deposited conductive material generally conforms to the valley. The conductive material is in electrical flow communication with the chip.
Claims13
A micro-fluid ejection head comprising:
- a substrate having a plurality of fluid ejection actuator devices adjacent to a device surface thereof and a valley adjacent to the device surface of the substrate;
- a semiconductor chip associated with the plurality of fluid ejection actuator devices, the chip being in the valley adjacent the device surface of the substrate;
- a conductor material deposited adjacent to the device surface of the substrate, wherein the deposited conductor material generally conforms to the valley, the conductive material being in electrical flow communication with the chip;
- and
- a glaze layer adjacent to the device surface of the substrate to provide a surface roughness of less than about 7.5 nanometers.
A micro-fluid ejection head comprising:
- a substrate having a plurality off fluid ejection actuator devices adjacent to a device surface thereof and a valley adjacent to the device surface of the substrate;
- a semiconductor chip associated with the plurality of fluid ejection actuator devices, the chip being in the valley adjacent the device surface of the substrate;
- a conductor material deposited adjacent to the device surface of the substrate, wherein the deposited conductor material generally conforms to the valley, the conductive material being in electrical flow communication with the chip;
- and
- wherein the valley has a side wall having a slope that provides a connecting trace radius area that is a square root of two tines a depth of the valley.
Dependencies are inferred from the claim text.