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US 7,677,432 B2Granted
Spot heat wirebonding
AssigneeTexas Instruments Incorporated
InventorsNorihiro Kawakami, Yoshikatsu Umeda, Sohichi Kadoguchi
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Abstract
Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.
Claims1
A method of wirebonding for use in assembling electronic devices comprising the steps of:
- positioning a bondwire and ball adjacent to a bonding site with a bonding tool;
- transmitting electromagnetic energy for heating the bondwire, ball, and bonding tool;
- subsequently placing the ball in contact with the bonding site using the bonding tool, whereby a wirebond is formed between the ball and bonding site.
Dependencies are inferred from the claim text.