Workpiece with a recess which is closed from the exterior by means of a solder film and method for closing a recess by means of a solder film
AssigneeSiemens Aktiengesellschaft
InventorsAndre Jeutter, Silke Settegast
Life of this patent
Estimating the term…
Abstract
It is known from the prior art that holes in a workpiece are filled completely with a solder powder, which leads especially in the case of large holes to the formation of cracks within the solder due to the large volume filled in once the solder cools off after soldering. The invention provides a method for closing a recess of a workpiece, which allows closing an opening of a recess without the risk of crack formation, by using only a solder film for closing the recess. The solder film has a content of non-melting material and therefore is substantially less prone to form cracks.
Claims11
A turbine component, comprising:
- a base body comprising a nickel base super alloy base material;
- a blind hole or through hole in the base body;
- and
- a soldering foil including a solder material that covers the blind hole or through hole and is soldered to the base body;
- wherein the soldering foil comprises a pressed powder mixture of two different powders, where the first powder comprises the nickel base super alloy base material that does not melt at a soldering temperature and the second powder comprises the solder material which does melt at the soldering temperature.
A turbine component comprising:
- a super alloy material base body comprising at least one hole, the super alloy material processed at a heat treatment temperature;
- and
- a pressed powder soldering foil arranged over the at least one hole and soldered to the base body such that the hole is effectively sealed-off by the foil,
- wherein the soldering foil comprises a pressed powder mixture of the superalloy material and a solder material powder, the solder material powder exhibiting a melting temperature below the heat treatment temperature, such that the foil is soldered to the base body during heat treatment of the base body without a separate soldering step.
Dependencies are inferred from the claim text.