Lightweight circuit board with conductive constraining cores
AssigneeStablcor, Inc.
InventorsKalu K. Vasoya, Bharat M. Mangrolia, William E. Davis, Richard A. Bohner
Life of this patent
Estimating the term…
Abstract
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Claims23
A printed wiring board, comprising:
- a laminate formed from a substrate including a non-metallized carbon fiber material to which at least one layer of metal is clad by resin impregnated in the non-metallized carbon fiber material, where the laminate has a first side and a second side;
- a first prepreg located within the printed wiring board adjacent the first side of the laminate;
- and
- a second prepreg located within the printed wiring board adjacent the second side of the laminate;
- wherein the laminate is configured to form a power plane.
A printed wiring board, comprising:
- a laminate formed from a substrate including a non-metallized carbon fiber material to which at least one layer of metal is clad by resin impregnated in the non-metallized carbon fiber material, where the laminate has a first side and a second side;
- a first prepreg located within the printed wiring board adjacent the first side of the laminate;
- a second prepreg located within the printed wiring board adjacent the second side of the laminate;
- and
- a hole lined with electrically conductive material extending through the laminate;
- wherein the electrically conductive material lining the hole is in electrical contact with the non-metallized carbon fiber material.
A printed wiring board, comprising:
- a laminate formed from a substrate including a non-metallized carbon fiber material to which at least one layer of metal is clad by resin impregnated in the non-metallized carbon fiber material, where the laminate has a first side and a second side;
- a first prepreg located within the printed wiring board adjacent the first side of the laminate;
- and
- a second prepreg located within the printed wiring board adjacent the second side of the laminate;
- and
- wherein the laminate is configured to form a ground plane.
A printed wiring board comprising:
- a laminate formed from a substrate including a non-metallized carbon fiber material to which at least one layer of metal is clad by resin impregnated in the non-metallized carbon fiber material, where the laminate has a first side and a second side;
- a first prepreg located within the printed wiring board adjacent the first side of the laminate;
- and
- a second prepreg located within the printed wiring board adjacent the second side of the laminate;
- wherein the laminate forms a ground and power plane.
Dependencies are inferred from the claim text.