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US 7,661,461 B2Granted
Cooling device for CPU
AssigneeCompTake Technology Inc.
InventorWei-Hau Chen
Life of this patent
Estimating the term…
Abstract
A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cooling units are connected to the cooling pipes and each cooling unit includes fins and a cooling fan which generates air flows toward the fins and cooling the parts around the CPU.
Claims1
A cooling device comprising:
- a base including at least one connection member which includes grooves and the base adapted to be connected on a heat source, the base including at least one fixing member which is adapted to secure the base on a circuit board;
- a pipe unit including at least one absorbing pipe which is engaged with the grooves of the base and two cooling pipes connected on two ends of the at least one absorbing pipe and extending in V-shape, and
- two cooling units connected to the two cooling pipes and each of the two cooling units including fins and a cooling fan, the fins and the fans located at an angle relative to the circuit board.
Dependencies are inferred from the claim text.