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US 7,658,831 B2Granted
Three dimensional microstructures and methods for making three dimensional microstructures
AssigneeFormFactor, Inc.
InventorsGaetan L. Mathieu, Treliant Fang, Eric D. Hobbs
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Abstract
Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
Claims32
A method of making a three-dimensional structure, the method comprising:
- depositing a plurality of droplets in a three-dimensional array, the array comprising:
- a first type of droplets disposed to form a support structure, a surface of the support structure being embedded within the array,
- a second type of droplets forming a conductive seed layer on the surface of the support structure, the seed layer being at least partially embedded within the array, and
- a third type of droplets covering at least part of the seed layer;
- removing the third type of droplets, exposing the conductive seed layer:
- and electrodepositing a structure material onto the exposed seed layer.
3 more elements
Dependencies are inferred from the claim text.