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US 7,656,256 B2Granted
Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof
AssigneeNuvotronics, PLLC
InventorsWilliam D. Houck, David W. Sherrer
Life of this patent
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Abstract
Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Claims17
A three-dimensional microstructure formed by a sequential build process, comprising:
- a first microstructural element comprising a dielectric material and having at least one aperture extending at least partially therethrough;
- a second microstructural element comprising a metal material and having the at least one aperture of the first microstructural element embedded therein;
- a metal material in the aperture affixing the first microstructural element to the second microstructural element;
- and
- a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
2 more elements
A method of forming a three-dimensional microstructure by a sequential build process, comprising:
- disposing a plurality of layers over a substrate, wherein the layers comprise a layer of a dielectric material, a layer of a metal material and a layer of a sacrificial material;
- forming a first microstructural element comprising the dielectric material and having at least one aperture extending at least partially therethrough;
- forming a second microstructural element comprising the metal material;
- depositing a metal material in the at least one aperture, affixing the first microstructural element to the second microstructural element;
- and
- removing the sacrificial material to form a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
3 more elements
A three-dimensional microstructure formed by a sequential build process, comprising:
- a first microstructural element comprising a dielectric material and having at least one aperture extending at least partially therethrough;
- a second microstructural element comprising a metal material;
- a metal material in the at least one aperture affixing the first microstructural element to the second microstructural element;
- a substrate over which the first and second microstructural elements are disposed;
- and
- a non-solid volume to which the first microstructural element and/or the second microstructural element are exposed.
3 more elements
Dependencies are inferred from the claim text.