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US 7,646,029 B2Granted
LED package methods and systems
AssigneePhilips Solid-State Lighting Solutions, Inc.
InventorsGeorge G. Mueller, Kevin J. Dowling, Frederick M. Morgan, Ihor A. Lys
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Abstract
Methods and systems are provided for LED modules that include an LED die integrated in an LED package with a submount that includes an electronic component for controlling the light emitted by the LED die. The electronic component integrated in the submount may include drive hardware, a network interface, memory, a processor, a switch-mode power supply, a power facility, or another type of electronic component.
Claims37
A light source, comprising:
- at least one LED die including an LED;
- a first electronic component, including a control facility;
- and
- a package for the LED die, the package including a submount,
- wherein the submount incorporates at least one second electronic component for controlling the LED,
- wherein the at least one second electronic component is coupled between the first electronic component and the LED die, and
- wherein the at least one second electronic component facilitates control of at least one of the intensity and the apparent intensity of the LED die.
4 more elements
A method for providing a light source comprising:
- including at least one LED in an LED die;
- packaging the LED die with a submount;
- incorporating a first electronic component, including a control facility, and at least one second electronic component for controlling the LED in the submount;
- and
- coupling the at least one second electronic component between the LED die and the first electronic component for facilitating control of at least one of the intensity and the apparent intensity of the LED die.
2 more elements
Dependencies are inferred from the claim text.