Bonding of target tiles to backing plate with patterned bonding agent
AssigneeApplied Materials, Inc.
InventorsHien-Minh Huu Le, Akihiro Hosokawa
Life of this patent
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Abstract
A target assembly including a plurality of target tiles bonded to a backing plate by adhesive, for example of indium or conductive polymer, filled into recesses in the backing plate formed beneath each of the target tiles. A sole peripheral recess formed as a rectangular close band may be formed inside the tile periphery. Additional recesses may be formed inside the peripheral recess, preferably symmetrically arranged about perpendicular bisectors of rectangular tiles. The depth and width of the recesses may be varied to control the amount of stress and the stress direction.
Claims18
A sputtering target assembly, comprising:
- a backing plate;
- and
- at least one target tile bonded to said backing plate in a respective tile area thereof and configured for sputtering from the target tile of a material of the target tile;
- wherein said backing plate is formed with at least one predetermined recess filled with said adhesive.
A sputtering target assembly, comprising:
- a backing plate;
- and
- at least one target tile bonded to said backing plate in a respective tile area thereof and configured for sputtering from the target tile of a material of the target tile;
- wherein said backing plate is formed with at least one predetermined recess filled with said adhesive and wherein said at least one recess includes a first recess and a second recess differing between the in at least one of depth and width.
A sputtering target assembly, comprising:
- a backing plate configured for attachment to a vacuum chamber,
- at least one target tile bonded to said backing plate in a respective tile area thereof and configured for sputtering from the target tile of a material of the target tile, wherein the at least one target tile comprises a material to be sputtered in the vacuum chamber,
- wherein said backing plate is formed with at least one predetermined recess filled with said adhesive;
- wherein the at least one predetermined recess has a recess area smaller than the respective tile area of the respective tile bonded in the respective tile area, and
- wherein the at least one predetermined recess extends only partially through the backing plate in each of said tile areas.
Dependencies are inferred from the claim text.