Heat-dissipating module having a dust removing mechanism, and assembly of an electronic device and the heat-dissipating module

An assembly of an electronic device and a heat-dissipating module, said assembly comprising:

• an electronic device including a housing, and an electronic component disposed within said housing, said housing being provided with an air outlet port;
• a heat-dissipating module including
• a heat-dissipating fin base disposed within said housing and adjacent to said air outlet port, said heat-dissipating fin base including two upright sidewalls spaced apart from each other, a base wall connected to said two upright sidewalls, and a plurality of heat-dissipating fins arranged between said upright sidewalls at spaced intervals,
• a conducting pad to contact said electronic component, and
• a conducting heat pipe having a first end connected to said heat-dissipating fin base, and a second end connected to said conducting pad;
• and
• a dust removing mechanism including
• a scraping plate disposed movably between said two upright sidewalls, said scraping plate having a plurality of scraping teeth and a force application portion connected to said scraping teeth and accessible outwardly of said housing, said scraping teeth extending respectively into clearances among said heat-dissipating fins, said force application portion being operable to bring said scraping teeth to displace relative to said heat-dissipating fins.