Methods for forming an anti-tamper pattern

A method of forming a conductive pattern on an electronic device, the conductive pattern to detect tampering of the electronic device, the method comprising:

• forming at least one terminal on the electronic device, the electronic device comprising at least one of a semiconductor device, an integrated circuit chip, and an electronic substrate;
• forming a non-conductive layer on the electronic device;
• positioning the electronic device proximate a second device, the second device for forming the conductive pattern;
• and
• moving at least one of the electronic device and the second device to form the conductive pattern on at least two surfaces of the electronic device with the second device, wherein the conductive pattern is formed on the non-conductive layer and comprises a plurality of conductive traces, and wherein each one of the plurality of conductive traces is formed on each one of the at least two surfaces of the electronic device and is continuous therebetween;
• wherein the conductive pattern is electrically connected to the at least one terminal, and wherein the at least one terminal facilitates electrical conduction between the conductive pattern and an electrical detection circuit of the electronic device.