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US 7,633,162 B2Granted
Electronic circuit with embedded memory
OwnerSang-Yun Leeinventor
Life of this patent
Estimating the term…
Abstract
Circuitry includes first and second circuits spaced apart by an interconnect region. The interconnect region includes a first interconnect and the second circuit includes a stack of semiconductor layers. The first interconnect extends between the first and second circuits to provide communication therebetween. The second circuit operates as a memory circuit.
Claims55
Circuitry comprising:
- a substrate;
- control circuitry carried by the substrate;
- processor circuitry carried by the substrate and positioned near the control circuitry;
- an interconnect region positioned on surfaces of the control and processor circuitry to provide communication therebetween;
- and
- memory circuitry positioned on the interconnect region, the memory circuitry being formed from a stack of crystalline semiconductor materials, the interconnect region providing communication between the memory circuitry and the control circuitry.
3 more elements
Circuitry comprising:
- a substrate;
- control and processor circuitry carried by the substrate;
- an interconnect region which provides communication between the control and processor circuitry;
- and
- memory circuitry spaced from the control and processor circuitry by the interconnect region, the memory circuitry being formed from a stack of crystalline semiconductor materials, the interconnect region providing communication between the memory circuitry and the control circuitry;
- wherein current flow through the stack of semiconductor layers is in a direction at a non-zero angle relative to the surface of the substrate.
3 more elements
Circuitry comprising:
- a substrate;
- control and processor circuitry carried by the substrate;
- an interconnect region which covers the control and processor circuitry and provides communication therebetween;
- and
- memory circuitry positioned on the interconnect region, the memory circuitry including a vertically oriented semiconductor device, the interconnect region providing communication between the vertically oriented semiconductor device and the control circuitry.
2 more elements
Circuitry, comprising:
- control and processor circuitry carried by a substrate;
- an interconnect region;
- and memory circuitry carried by the interconnect region, wherein the memory circuitry includes a stack of semiconductor materials, wherein the stack of semiconductor materials includes crystalline semiconductor material;
- wherein the interconnect region extends between the memory circuitry and substrate so the memory circuitry is spaced from the substrate by interconnect region.
1 more element
Dependencies are inferred from the claim text.