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US 7,633,154 B2Granted
Encapsulation and methods thereof
AssigneeIndustrial Technology Research Institute
InventorsMing-Ji Dai, Chun-Kai Liu, Chih-Kuang Yu, Shih-Hsien Wu
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Abstract
The invention discloses an encapsulation comprising a metal substrate, a PCB on the metal substrate, a thermo-electric element in and/or on the PCB, and an LED on the thermo-electric element. Encapsulating methods are also provided by the invention.
Claims12
An encapsulation, comprising:
- a metal substrate;
- a first PCB on the metal substrate;
- a first thermo-electric element comprising a plurality of P-type electrodes, n-type electrodes and first electrodes, said first thermo-electric element being directly disposed on the first PCB, wherein the P-type electrodes are electrically connected to the n-type electrodes through the first electrodes;
- and
- a first light emitting diode on the first thermo-electric element, said first light emitting diode being directly in contact with the first thermo-electric element.
2 more elements
An encapsulation, comprising:
- a metal substrate;
- a first PCB on the metal substrate;
- a first thermo-electric element comprising a plurality of P-type electrodes, n-type electrodes and first electrodes, said first thermo-electric element being disposed in the first PCB, wherein the P-type electrodes are electrically connected to the n-type electrodes through the first electrodes;
- and
- a light emitting diode on the first thermo-electric element, said light emitting diode being directly in contact with the first thermo-electric element.
2 more elements
Dependencies are inferred from the claim text.