Apparatus for testing a device with a high frequency signal
AssigneeAdvantest Corporation
InventorYoshimasa Ito
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AssigneeAdvantest Corporation
InventorYoshimasa Ito
Estimating the term…
The present invention provides an apparatus for testing a device with a high frequency signal, such as an RF signal. The apparatus delivers a high frequency signal directly to a loadboard with a coaxial cable. The coaxial cable can deliver the signal to a location at or near the device on the loadboard. The cable can connect to the loadboard through a threaded connection. The other end of the cable can connect to a testing module or another cable. The apparatus can further comprise a section or housing between the circuit board and the testing module to provide support for the cables and their respective connections. The apparatus can further provide connections for both high frequency testing and low frequency testing.
An apparatus for testing a device comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Features relating to contacting the IC under test, e.g. probe heads; chucks: interfaces, e.g. between probe and tester
Measuring electric variables
Term ended 19 Nov 2024 (estimated)
The present invention relates to an apparatus for testing a device with a high frequency signal and, more particularly, to an apparatus for testing a device by delivering a high frequency signal with a coaxial cable at or near the device.
Automatic test equipment systems or ATE systems are used to test devices such as semiconductor devices. An ATE system typically comprises a tester that generates test signals which are transmitted to a test head. The test head houses a plurality of modules. The test signals are transmitted from the modules to contact pins or pogo pins. The pins are arranged to contact the periphery of a circuit board or loadboard. Traces in the loadboard deliver the test signals from the periphery of the loadboard to a socket at the center of the loadboard. A device under test or DUT is inserted into the socket to establish electrical contact for testing. Thus, the test signals are transmitted from the tester to the DUT through the modules, contact pins, loadboard and socket. The resulting signals from the DUT are received by the tester for evaluation through the same elements.
The semiconductor devices are typically tested with low frequency signals. With the development of new types of semiconductor devices along with new testing protocols, it is currently preferable to test a DUT with a higher frequency signal.
FIG. 1 is a schematic illustration of a circuit board embodying the present invention.
FIG. 2 is a schematic partial side illustration of a circuit board embodying the present invention with additional detail relating to a coaxial cable connection and support.
FIG. 3 is a partial exploded side view of a testing apparatus embodying the present invention.
In the following description of embodiments, reference is made to accompanying drawings which form a part hereof and in which is shown by way of illustration specific embodiments in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the preferred embodiments of the present invention.
FIG. 1 shows a schematic illustration of a circuit board embodying the present invention while FIG. 2 shows a schematic partial side illustration of a circuit board embodying the present invention with additional detail relating to a coaxial cable connection and support. The following discussion references both FIG. 1 and FIG. 2 and like reference numerals refer to the same element.
Circuit board 1 is a printed circuit board having an circular shape. Circuit board 1 can be any other shape, such as elliptical, rectangular or square. On circuit board 1, a socket 2 is mounted. Socket 2 houses a device 3 for testing. FIG. 2 illustrates device 3 inserted in socket 2. Devices to be tested include, but are not limited to, W-LAN, cell phone, audio, video, disk drive, HDTV, DVD, and other RF, analog, and mixed-signal integrated circuits.