Vision system
AssigneeApplied Materials, Inc.
InventorsIraj Sadighi, Jeff Hudgens, Michael Rice, Gary Wyka
Life of this patent
Estimating the term…
Abstract
A vision system and method for calibrating motion of a robot disposed in a processing system is provided. In one embodiment, a vision system for a processing system includes a camera and a calibration wafer that are positioned in a processing system. The camera is positioned on the robot and is adapted to obtain image data of the calibration wafer disposed in a predefined location within the processing system. The image data is utilized to calibrate the robots motion.
Claims17
A method for calibrating motion of a robot disposed in a semiconductor processing system, the method comprising:
- positioning a calibration wafer in a placed position in a semiconductor processing system using a robot motion routine selected to place the calibration wafer in a target position;
- positioning a camera on a robot;
- viewing the calibration wafer disposed in the placed position with the camera disposed on the robot;
- and
- determining a relative distance between the placed position of the calibration wafer and the target position using an image of the calibration wafer.
A method for calibrating motion of a robot disposed in a semiconductor processing system, the method comprising:
- moving a camera disposed on a robot to a predefined position within a semiconductor processing system;
- capturing one or more images of a substrate support with the camera;
- determining a reference motion to be utilized by the robot to transfer a substrate to the substrate support from the captured images;
- transferring a wafer to the substrate support using the reference motion;
- viewing the wafer disposed on the substrate support with the camera;
- capturing one or more images of a wafer with the camera;
- and
- determining a corrected reference motion to be utilized by the robot to place the wafer on the substrate support in a predetermined position.
A method for calibrating motion of a robot disposed in a semiconductor processing system, the method comprising:
- positioning a camera on a locating plate disposed on a robot disposed in a semiconductor processing system;
- capturing one or more images of a wafer placed on a substrate support by the robot with the camera disposed on the locating plate;
- comparing the images viewed by the camera with a reference image stored in a controller, and
- determining a correction of a robotic motion routine utilized to place the wafer on the substrate support using the compared images.
Dependencies are inferred from the claim text.