3 dimensional layered flex circuit electronic assembly designed to maximize the cooling of electronics that are contained within the assembly such that the component density within said electronic assembly can be maximized

Abstract

A 3 dimensional electronic assembly comprised of a series or plurality of electronic Flex circuit sub-assemblies that form a layered Flex circuit assembly. Each Flex circuit sub-assembly is electronically connected to one or more other Flex circuits forming a multi-layer electronic Flex circuit assembly where various layers are separated by a substance that is designed to transfer heat away from the electronic components with the intent of cooling the electronic devices contained within the assembly. Each said Flex circuit sub-assembly/layer contains one or more trace layers for the conduction of electronic signals, power, and ground. Each Flex circuit layer may also contain electronic components such that the overall device forms an electronic assembly with embedded electronic components. A layered Flex circuit assembly will contain at least two Flex circuit sub-assemblies to which electronic components are electrically attached forming a 3 dimensional electronic assembly. 3 dimensional electronic assemblies may be assembled within an external package. Various forms of heat transfer are used to cool the electronic devices contained within the assembly. Heat transfer mechanisms include directed air flow, embedded heat sinks, heat conduction through a liquid, embedded heat pipes, and an enclosure that is designed to operate as a heat pipe.

Dependencies are inferred from the claim text.