Direct-manufactured duct interconnects
AssigneeThe Boeing Company
InventorsChris Huskamp, Tracy L. Bagwill
Life of this patent
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AssigneeThe Boeing Company
InventorsChris Huskamp, Tracy L. Bagwill
Estimating the term…
A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.
A method for forming a duct connector, the method comprising:
Dependencies are inferred from the claim text.