Thermal conducting medium protector

A thermal conducting medium protector, applicable for being assembled to a carrier to protect a thermal conducting medium disposed on a surface of the carrier, comprising:

• a shell, having a first buckling portion, an opening, a first side surface, and a second side surface opposite to the first side surface, wherein the first buckling portion is located on one side of the shell, and when the carrier is placed on the first side surface of the shell, the thermal conducting medium is located in the opening;
• and
• a cover plate, having a second buckling portion, a first side, and a second side opposite to the first side, wherein the second buckling portion is located on the first side, the second side includes a flexible portion, connected between the shell and the cover plate, wherein the cover plate is pivoted to the shell via the flexible portion, and after the carrier is placed on the first side surface of the shell, the cover plate rotates along the second side and then spans across the carrier, and the second buckling portion is buckled with the first buckling portion to hold the carrier between the shell and the cover plate.