High-impedance substrate, antenna device and mobile radio device
AssigneeKabushiki Kaisha Toshiba
InventorsMakoto Higaki, Kazuhiro Inoue, Shuichi Sekine, Akihiro Tsujimura
Life of this patent
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Abstract
There is provided with a high-impedance substrate including: a finite ground plane; a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane; and a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein outer metal plates arranged at an outermost periphery among the plurality of metal plates are connected with the linear conductive elements at edges of the outer metal plates.
Claims16
A high-impedance substrate comprising:
- a finite ground plane;
- a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane;
- and
- a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and, wherein
- the plurality of metal plates comprises outer plates arranged at an outermost periphery and inner metal plates, and a planar area of the outer metal plates is smaller than a planar area of inner metal plates different from the outer metal plates among the metal plates, and
- the outer metal plates are connected with the linear conductive elements at edges of the outer metal plates.
A portable radio device comprising:
- a high-impedance substrate including
- a finite ground plane,
- a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane, and
- a plurality of linear conductive elements configured to connect the plurality of metal plates to the finite ground plane and,
- wherein the plurality of metal plates comprises outer plates arranged at an outermost periphery and inner metal plates, and a planar area of the outer metal plates is smaller than a planar area of inner metal plates different from the outer metal plates among the metal plates, and the outer metal plates are connected with the linear conductive elements at edges of the outer metal plates;
- an antenna arranged at a predetermined height from the finite ground plane or at a higher height;
- a radio circuit configured to generate high-frequency current;
- and
- a feeding line configured to supply high-frequency current generated by the radio circuit to a feeding point of the antenna.
A high-impedance substrate comprising:
- a finite ground plane;
- 2 by “n” (where “n” is an integer equal to or greater than 2) number of metal plates arranged at a predetermined height from the finite ground plane and in a 2-row matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane;
- and
- 2 by “n” number of linear conductive elements configured to connect the metal plates to the finite ground plane and, wherein
- a planar area of first metal plates arranged at corners among the 2 by “n” number of metal plates are smaller than a planar area of second metal plates other than the first metal plates among the 2 by “n” number of metal plates,
- the first metal plates are connected with the linear conductive elements at intersections of sides on which an adjacent metal plate does not exist, and
- the second metal plates are connected with linear conductive elements at a side on which an adjacent metal plate does not exist.
Dependencies are inferred from the claim text.