US 7,623,034 B2 · High-speed RFID circuit placement method and device

Abstract

A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

Claims10

Dependent claims

A method of placing an RFID circuit onto an electrical component, the method comprising:

separating an RFID circuit from a web of RFID circuits using a punch member to punch the RFID circuit from the web;
and
placing the RFID circuit onto an electrical component with a placement device;
wherein the separating includes:
severing the RFID circuit from the web of RFID circuits;
separably coupling the RFID circuit to a punch member by applying a vacuum to the RFID circuit via a vacuum port in the punch member;
directing the RFID circuit onto a transfer drum of the placement device using the punch member;
and separably coupling the RFID circuit to the transfer drum;
and wherein the placing includes transferring the RFID circuit onto the electrical component with the transfer drum.

6 more elements

Dependencies are inferred from the claim text.

High-speed RFID circuit placement method and device

Life of this patent

High-speed RFID circuit placement method and device

Life of this patent

Abstract

Claims10