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US 7,622,940 B2Granted
Semiconductor device having contact failure detector
AssigneeSamsung Electronics Co., Ltd.
InventorsGwang-Young Kim, Jong-Youb Kim, Boung-Lyoul Jung, Joon-Su Ji
Life of this patent
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Abstract
A semiconductor device having a circuit for detecting a defective connection to the semiconductor device. A semiconductor device including multiple internal circuits; multiple pads respectively connected to the internal circuits; and a contact failure detector coupled between the pads and a common node and configured to detect contact failures between tips of a probe card and the pads.
Claims18
A semiconductor device comprising:
- a plurality of internal circuits;
- a plurality of pads respectively connected to the internal circuits;
- a contact failure detector coupled between the pads and a common node and configured to detect contact failures of connections to the pads;
- and
- a controller unit coupled between the cads and the contact failure detector for selectively coupling the cads to the contact failure detector, the controller unit including:
- a plurality of transistors, each transistor coupled between a corresponding one of the pads and the contact failure detector;
- and
- at least one logic unit to apply at least one control signal to the transistors in response to a plurality of input signals.
5 more elements
A semiconductor device comprising:
- a pad;
- a circuit coupled to the pad;
- a resistor coupled between the pad and a ground;
- a transistor coupled between the resistor and the pad;
- and
- a logic unit coupled to the transistor and configured to apply a control signal to the transistor in response to a plurality of input signals;
- wherein a current flowing through the resistor indicates whether a connection to the pad is defective.
4 more elements
A semiconductor device comprising:
- a plurality of internal circuits;
- a plurality of pads respectively connected to the internal circuits;
- a contact failure detector coupled between the pads and a common node and configured to detect contact failures of connections to the pads;
- and
- a signal breaker coupled between the pads and the contact failure detector;
- wherein the signal breaker comprises a plurality of fuses, each fuse coupled between a corresponding one of the pads and the contact failure detector.
3 more elements
A semiconductor device comprising:
- a plurality of internal circuits;
- a plurality of pads respectively connected to the internal circuits;
- a contact failure detector coupled between the pads and a common node and configured to detect contact failures of connections to the pads;
- and
- a controller unit coupled between the pads and the contact failure detector for selectively coupling the pads to the contact failure detector;
- wherein:
- the controller unit comprises a plurality of transistors, each transistor coupled between a corresponding one of the pads and the contact failure detector and a plurality of logic units to apply a plurality of control signals to the transistors;
- each logic unit comprises an OR gate to generate the corresponding control signal in response to a first input signal and a second input signal;
- the first input signal indicates that a testing is being performed at a fabrication stage;
- and
- the second input signal indicates that the testing is being performed at a packaging stage.
8 more elements
A semiconductor device comprising:
- a pad;
- a circuit coupled to the pad;
- a resistor coupled between the pad and a ground;
- a transistor coupled between the resistor and the pad;
- and
- a logic unit coupled to the transistor and configured to apply a control signal to the transistor;
- wherein:
- a current flowing through the resistor indicates whether a connection to the pad is defective;
- the logic unit is configured to generate the control signal in response to a first input signal and a second input signal;
- the first input signal indicates that a testing is being performed at a fabrication stage;
- and
- the second input signal indicates that the testing is being performed at a packaging stage.
9 more elements
Dependencies are inferred from the claim text.