Semiconductor assembly with component attached on die back side
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Francis Heap Hoe Kuan
Life of this patent
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Abstract
One or more electronic components can be mounted on the back side of a semiconductor die. The components can be passive components, active components, or combinations thereof. The components can be soldered to signal routes on the back side of the die, the signal routes being attached to the die using a metallization layer or using one or more dielectric layer sections. Placing components on the back side of the die can allow for incorporation of the components without necessarily increasing the form factor of the die's package.
Claims16
A semiconductor assembly, comprising:
- a semiconductor die having a perimeter, an active side and a back side;
- a dielectric material section having a first side and a second side, wherein the first side is attached to the back side of the semiconductor die;
- a plurality of component pads attached to the second side of the dielectric material section and positioned within the semiconductor die perimeter, the plurality of component pads comprising a first pad and a second pad, the first pad being laterally opposed to the second pad;
- and
- one or more electronic components electrically coupled with one or more of the component pads.
A method of making a semiconductor assembly, the method comprising:
- providing a semiconductor die having a perimeter, an active side and a back side;
- providing a dielectric material section having a first side and a second side;
- attaching the first side of the dielectric material section to the back side of the semiconductor die;
- forming a plurality of component pads on the second side of the dielectric material section and positioned within the semiconductor die perimeter, the plurality of component pads comprising a first pad and a second pad, the first pad being laterally opposed to the second pad;
- and
- electrically coupling one or more electronic components with at least two of the plurality of component pads.
Dependencies are inferred from the claim text.