Heat sink assembly and related methods for semiconductor vacuum processing systems
AssigneeCree, Inc.
InventorsWinston T. Parker, Van Mieczowski, Jim Wood, Daniel Cronin, David Emerson
Life of this patent
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Abstract
An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally conductive heat sink carrier in the at least one wafer pocket. The heat sink carrier includes a first surface in contact with a surface within the at least one wafer pocket and a second surface opposite the first surface. A heat sink is affixed to the second surface of the heat sink carrier.
Claims23
An assembly for supporting a substrate during vacuum processing operations, comprising:
- a thermally conductive heat sink tray including at least one wafer pocket recessed therein;
- a thermally conductive heat sink carrier in the at least one wafer pocket, the heat sink carrier including a first surface in contact with a surface within the at least one wafer pocket and a second surface opposite the first surface;
- and
- a heat sink on the second surface of the heat sink carrier.
A heat sink assembly for supporting a wafer during vacuum processing, comprising:
- a thermally conductive heat sink carrier;
- a heat sink affixed to the heat sink carrier, wherein the heat sink has a flatness of about +/−20 μm or less;
- and
- a metallic bonding layer between the heat sink carrier and the heat sink.
Dependencies are inferred from the claim text.