Electronic device with semiconductor chip including a radiofrequency power module
AssigneeInfineon Technologies AG
InventorsStefan Paulus, Martin Petz
Life of this patent
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Abstract
An electronic device, including a radiofrequency power module, includes a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side, a metallic housing bottom including at least one chip island, and at least one semiconductor chip. Each semiconductor chip is arranged on each chip island and includes a top side and a rear side. The plastic walls of the cavity housing are connected to the metal frame in a positively locking manner with anchoring elements, and the housing bottom is connected to the rear side of the metal frame in a thermostable manner with a solder joint.
Claims7
An electronic device including a radiofrequency power module, the electronic device comprising:
- a cavity housing including a housing frame with plastic walls and with a metal frame including a top side and a rear side;
- a metallic housing bottom including at least one chip island;
- and
- at least one chip, each chip being arranged on each chip island and including a top side and a rear side;
- wherein the plastic walls of the cavity housing are connected to the metal frame with anchoring elements, and the housing bottom is connected to the rear side of the metal frame with a solder joint.
Dependencies are inferred from the claim text.