Integrated circuit devices with stacked package interposers

An integrated circuit device comprising:

• a die containing an integrated circuit with a first and a second bond pad;
• a first package interposer stacked over and attached to a separate second package interposer and separated from the second interposer solely by nonconductive material, the die being stacked over and attached to the first interposer-and separated from-the first interposer solely by nonconductive material, the first interposer including a bond pad at an elevational level with respect to the die which is different from an elevational level of a bond pad included in the second interposer;
• and
• a first opening completely through the first interposer and a second opening completely through the second interposer, a first conductive wire passing through the first opening from the die's first bond pad directly to the first interposer's bond pad, and a second conductive wire passing through both the first and second openings from the die's second bond pad directly to the second interposer's bond pad.

An integrated circuit device comprising:

• a first die containing an integrated circuit with a bond pad;
• a second die containing an integrated circuit with a bond pad;
• a first package interposer stacked over a separate second package interposer and separated from the second interposer solely by nonconductive material, each interposer including a bond pad;
• and
• a first conductive connection from the first die's bond pad directly to the first interposer's bond pad and a second conductive connection from the second die's bond pad directly to the second interposer's bond pad.

An integrated circuit device comprising:

• a second die stacked over a separate first die, each die containing an integrated circuit with a bond pad;
• a first package interposer stacked over a separate second package interposer, each interposer including a bond pad and the first die being stacked over the first interposer;
• and
• a first conductive connection from the first die's bond pad directly to the first interposer's bond pad and a second conductive connection from the second die's bond pad directly to the second interposer's bond pad.

An integrated circuit device comprising:

• a second die stacked over and attached to a separate first die, each die containing an integrated circuit with a bond pad;
• a first package interposer stacked over and attached to a separate second package interposer and separated from the second interposer solely by nonconductive material, the first die being stacked over and attached to the first interposer and separated from the first interposer solely by nonconductive material, the first interposer including a bond pad at an elevational level with respect to the first die which is different from an elevational level of a bond pad included in the second interposer;
• and
• a first opening completely through the first interposer and a second opening completely through the second interposer and aligned with the first opening, a first conductive wire passing through the first opening from the first die's bond pad directly to the first interposer's bond pad, and a second conductive wire from the second die's bond pad directly to the second interposer's bond pad.