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US 7,622,793 B2Granted
Flip chip shielded RF I/O land grid array package
OwnerRichard A. Andersoninventor
Life of this patent
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Abstract
A novel apparatus and method for providing a radio frequency (“RF”) input/output (“I/O”) land grid array (“LGA”) package structure. The package structure comprises grounded shield rings surrounding free-standing RF I/O interconnects. The free-standing RF I/O interconnects eliminate long leads and the shield rings provide ground protection thereby minimizing losses, inductance, leakage, and crosstalk, and improving performance.
Claims14
A shielded land grid array package, comprising:
- a lead-frame substrate defining at least one free-standing radio frequency (RF) interconnect surrounded by at least one shield ring, the at least one free-standing RF interconnect being held in place by a first encapsulate;
- at least one flip chip mounted to the at least one free-standing RF interconnect wherein a flip chip RF lead couples to the at least one free-standing RF interconnect and a flip chip ground lead couples to the shield ring;
- and
- a second encapsulate disposed over the lead frame substrate, the at least one free-standing RF interconnect, and the at least one flip chip.
1 more element
Dependencies are inferred from the claim text.