EMI shielding for imager devices
AssigneeAptina Imaging Corporation
InventorLuke England
Life of this patent
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Abstract
A module that provides EMI shielding for imager devices is disclosed which includes a die comprising an imager device and a plurality of contact pads, a stack positioned above the imager device, the stack comprising at least one lens, a conductive layer positioned above the stack, the conductive layer comprising at least one light opening, and a plurality of wire bonds, each of which conductively couples the conductive layer to one of the contact pads on the die. A method of providing EMI shielding for an imager module is also disclosed which includes conductively coupling a conductive layer of the module to a plurality of contact pads on an imager die and forming an encapsulant material that encapsulates at least the plurality of wire bonds, the conductive layer and the contact pads.
Claims14
A module, comprising:
- a die comprising an imager device and a plurality of contact pads;
- a stack positioned above the imager device, the stack comprising at least one lens;
- a conductive layer positioned above the stack, the conductive layer comprising at least one light opening;
- and
- a plurality of wire bonds, each of which conductively couples the conductive layer to at least one of the contact pads on the die.
A module, comprising:
- a die comprising an imager device and a plurality of contact pads;
- a stack positioned above the imager device, the stack comprising at least one lens;
- a conductive layer positioned above the stack, the conductive layer comprising at least one light opening;
- a plurality of wire bonds, each of which conductively couples the conductive layer to one of the contact pads on the die, the plurality of wire bonds extending around an entire perimeter of the conductive layer;
- and
- an encapsulant material that is positioned at least around the plurality of wire bonds and the stack.
Dependencies are inferred from the claim text.